Digital instruments AFM |
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|---|---|
| Model | Nanoscope dimension 3000 |
| Type | commercial |
| Comments | |
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| Equipment Characteristics | |
| Batch sizes | 100 mm: 1, 125 mm: 1, 150 mm: 1, 200 mm: 1, 50 mm: 1, 75 mm: 1 |
| Piece dimension Range of wafer piece dimensions the equipment can accept |
10 .. 200 mm |
| Piece geometry Geometry of wafer pieces the equipment can accept |
circular, irregular, other, rectangular, triangular shard |
| Piece thickness Range of wafer piece thickness the equipment can accept |
200 .. 1000 µm |
| Wafer diameter(s) List or range of wafer diameters the tool can accept |
50 mm, 75 mm, 100 mm, 125 mm, 150 mm, 200 mm |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat, notched |
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
Pyrex (Corning 7740), quartz (fused silica), silicon, silicon on insulator |
| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 1000 µm |